![Scientific and technical journal «Priborostroenie»](/images/mag-pr.png)
PLACEMENT OPTIMIZATION OF PRINTED CIRCUIT BOARDS IN THERMAL DESIGN OF HERMETICALLY SEALED UNIT
![Scientific and technical journal «Priborostroenie»](/images/mag-pr.png)
Annotation
The influence of placing of printed circuit boards on thermal conditions of stack package is considered. Peculiarities of heat removal in hermetically sealed unit are described. A method for optimizing the boards placing with due regard for differences between heat power dissipated by separate functional units is developed with the use of a CAE system for simulation of thermal conditions.
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